Precautions for use of FPC flexible circuit board

FPC flexible circuit board is simple in design, small in size, and can be directly connected. It has great development space in the electronic product market. Among them, FPC flexible circuit board is widely used in mobile phones. It is highly compatible with cell phone batteries, display screens, touch screens and cameras. It is mainly composed of double-sided boards and rigid-flexible combination boards. Its lightweight and short advantages save a lot of space for the interior of mobile phones. The traditional connection mode is either complicated or has special electrical requirements. It also needs to process many signals, which is very inconvenient to use. With FPC flexible circuit board, it can greatly simplify the connection line inside the mobile phone and play a stable electrical transmission.



Precautions for use of FPC flexible circuit board:



1. FPC flexible circuit boards will be coated on the surface to effectively prevent oxidation. There are certain requirements for the environment during storage. The temperature should be controlled below 25 ° C and the humidity should be controlled within the range of 50% - 70%.



2. FPC flexible circuit board has strong bending resistance, but the conductor * * part is not suitable for bending, nor can it be bent directly on the through hole. The FPC ink type protective layer is prohibited to bend more than 90 ° C during the assembly process, let alone 180 ° C bending, which may cause problems such as wire breakage.



3. FPC flexible circuit board stress concentration areas, such as covering film, gold finger end, shape corner, etc., are prone to line fracture during assembly, so special attention should be paid when using.



Performance index of FPC flexible circuit board:



The performance of FPC flexible circuit board mainly includes: copper foil adhesion, solderability of solder pad, roundness of solder pad, clarity of screen printing, surface finish, line connectivity, insulation performance, etc. The appearance, material and performance of FPC FPC need to be comprehensively verified.



Copper foil adhesion refers to the adhesion between FPC wire and substrate. The copper foil adhesion is small, and FPC wire is easy to peel off from the pad substrate, so it needs to be verified. Apply transparent adhesive on the required FPC wire, remove bubbles and quickly pull it off in 90 ° direction. If the wire is intact, verify that the copper foil adhesion of FPC flexible circuit board is qualified.