Introduction of FPC circuit board metal film

The special metal films used in the production of FPC circuit boards include the following: 1. Lv film Lv film has been used in some special applications, which are expected to reduce weight or cost. Of course, its design will adapt to the needs of use. Lv film has been proved to be very successful in the simple shielding application of FPC circuit boards. Compared with conductive copper with the same performance, Lu is an excellent conductor and can reduce the weight by about one third. For the technology of mounting components on the FPC circuit board, the semiconductor terminal technology is easier to use than copper. 2. Beryllium copper is a good choice when seeking good conductivity, mechanical strength and similar spring characteristics. However, the conductivity of beryllium copper is less than that of copper, only one quarter of that of copper. This metal is one of the industrial standard materials for terminal connectors, mainly due to its special composite properties. 3. Ferroalloy film Various ferroalloys are also used in specific fields. It has been proved that they are valuable in the application of low thermal conductivity and transmission of electrical signals. A typical example is the interconnection between instruments of low temperature test device, which can provide relatively low current. Because the film resistance is quite high, it has been proved to be very useful in the production of FPC circuit board heaters. 4. Indium-tin oxide Indium-tin oxide (ITO) is quite famous because it is a transparent conductor material. The importance of LCD is very high, and it also provides the possibility of application in other fields, among which touch screen monitor is the most widely used. Such materials have high resistance, difficult production and high unit price. Some manufacturers have tried to use silver, copper and other ultra-fine lines to replace them. At present, some manufacturers have used this method to make FPC touch panels, but the overall application is still developing, and there are quite a lot of technologies to be breakthroughs. 5. The production of FPC circuit board made of elastic embedded resistance material also includes embedded passive components. The practitioners use the film specially made by ohmega industries. The film combines resistance and conductive layer, which must be produced by special three-step etching. It can make buried resistance circuit. Although it cannot be used with high-performance applications, it can still provide effective terminal resistance solutions, and can also help reduce the complexity and weight of assembly. It is a single resistor made of this material. 6. Special alloy and special alloy coated with nickel, nickel-chromium, etc. will be made into FPC circuit board, which is used to make interconnection circuit cooled by liquid nitrogen. The relatively low conductivity can be compensated by increasing the magnification.