What are the repair requirements for flexible circuit board SMD boards?

The repair of flexible circuit board mounting plates is a very important process. If not handled properly, it can lead to the scrapping of flexible circuit board mounting plates and affect the yield. So, what are the repair requirements for flexible circuit board SMD boards?



1、 Baking requirements for flexible circuit board patches and moisture sensitive components



1. All new components to be installed must be baked and dehumidified according to the humidity sensitivity level and storage conditions of the components, and in accordance with the relevant requirements of the "Specification for the Use of Moisture Sensitive Components".



2. If the repair process requires heating to above 110 ℃, or if there are other moisture sensitive components within 5mm of the repair area, baking and dehumidification treatment must be carried out in accordance with the relevant requirements of the "Specification for the Use of Moisture Sensitive Components" based on the moisture sensitivity level and storage conditions of the components.



3. For moisture sensitive components that need to be reused after repair, if repair processes such as hot air reflux, infrared, etc. are used to heat solder joints through the component packaging, they must be baked and dehumidified according to the relevant requirements in the "Specification for the Use of Moisture Sensitive Components" based on the moisture sensitivity level and storage conditions of the components. For the repair process using manual chrome iron heating solder joints, pre baking treatment can be avoided under the premise of controlled heating process.



2、 Storage environment requirements for flexible circuit board patches and components after baking



After baking, moisture sensitive components, flexible circuit board patches, and newly unpacked components that need to be replaced need to be re baked once the storage conditions exceed the deadline.



3、 Requirements for heating frequency of flexible circuit board patch repair



The cumulative repair heating allowed for components shall not exceed 4 times; The allowed number of repairs and heating for new components shall not exceed 5 times; The allowed number of repairs and heating cycles for reused components removed from the upper part shall not exceed 3.



The above are the requirements for the repair of flexible circuit board SMD boards. Shenlian Circuit hopes to be helpful to you.