FPC soft board production process

1、 Overview of FPC Softboard Products FPC Softboard is a fundamental product in the electronics industry, widely used in communication equipment, computers, automotive electronics, industrial equipment, and various household appliances. Its main function is to support circuit components and interconnect circuit components. FPC soft boards are a major category of printed circuit boards. Soft board manufacturers can be divided into single panel, double-sided board, and multi-layer board based on the structure of FPC flexible printed circuit boards and the number of conductor layers.



2、 The main raw materials (physical and chemical materials) used for FPC soft board manufacturing by soft board manufacturers are: (1) Flexible copper clad plate (FCCL): referred to as single sided copper clad plate or double sided copper clad plate according to the difference between covering one side with copper foil or both sides with copper foil; According to the difference between copper foil and substrate film with or without adhesive, it is called adhesive coated copper plate or non adhesive coated copper plate. The structure of flexible copper clad plate. Polyimide (PI), polyester (PET), polyethylene 2,6 naphthalate (PEN:), liquid crystal polymer (LCP) and other polymer films are commonly used as the base material film of flexible copper clad laminate. Copper clad board is mainly responsible for three functions: conductivity, insulation, and support on the entire printed circuit board. The performance, quality, processability during manufacturing, manufacturing cost, and manufacturing level of printed circuit boards largely depend on the performance of copper clad boards. (2) Covering film: It is composed of organic film and adhesive. The function of the covering film is to protect the conductor part of the completed flexible circuit. Adhesive films have different types and thickness specifications of substrate films and adhesives. Some FPC flexible circuit boards do not use a covering film on the surface, but instead use a coating of solder resist to reduce costs. (3) Adhesive film: It is a bonding film formed by pouring adhesive on two or one side of a substrate film, with or without a pure adhesive layer of the substrate. There are different adhesive types and thickness specifications for adhesive films. Adhesive film is used for interlayer bonding and insulation of multi-layer boards. (4) Copper foil: There are electrolytic copper foil, rolled copper foil, and different copper foil thickness specifications. Copper foil is used for two surface conductive layers in the production of multi-layer printed circuit boards. In addition, some FPC flexible circuit boards use reinforced materials such as metal sheets, plastic sheets, resin films, and epoxy glass substrates. The function of reinforcing materials is to reinforce the local area of the flexible circuit board for support and fixation. Because not all FPC flexible boards are used, they are not included in the unit consumption standard. 3、 The FPC soft board processing process is sheet by sheet processing, similar to the intermittent step by step processing of rigid boards. The FPC soft board adopts the same process and similar equipment conditions as the rigid board. In terms of processing form, there are sheet by sheet processing: Sheet by Sheet, similar to the intermittent step by step processing of rigid plates, or Roll to Roll processing, which is a continuous processing of a roll of substrate. The above is the knowledge of FPC soft board production process for soft board manufacturers, and strict control is still required for each process during the production process.