Introduction to FPC substrate copper clad plate

The most basic structure of FPC includes copper foil substrate and covering film. Copper foil substrate is used to form circuits, providing electrical performance for the final product. The covering film is attached to the surface of the circuit, playing a role in insulation, shielding and protecting the circuit, and enhancing the bending resistance of the circuit. Flexible copper clad plate refers to the copper clad plate formed by bonding one or both sides of flexible insulating materials such as polyester film or polyimide film with copper foil through certain process. Due to the rapid development of electronic technology, the output of flexible copper clad laminates has steadily increased, and the production scale has continued to expand. In particular, the demand and growth trend of high-performance flexible copper clad laminates based on polyimide films are more prominent.



The main materials composed of FPC substrate copper clad plate:



1. Adhesives: At present, the adhesives used for flexible copper clad laminate mainly include polyester adhesive, acrylic adhesive, epoxy or modified epoxy adhesive, polyimide adhesive, phenolic aldehyde butyraldehyde adhesive, etc. It directly affects the product performance and quality of flexible copper clad laminate.



2. Insulation base film materials: The insulation base film materials used for flexible copper clad laminate include polyester (PET) film, polyimide (PI) film, polyester Imide film, fluorocarbon vinyl film, amide fiber paper, Polybutylene phthalate film, etc. Among them, polyester film (PET film) and polyimide film (PI film) are most widely used at present.



3. Metal conductor foil: Metal conductor foil is a conductor material used for flexible copper clad panels, including copper foil, aluminum foil, and copper beryllium alloy foil. At present, the vast majority of copper foil is used, including electrolytic copper foil (ED) and rolled copper foil (RA).