FPC sandwich plate production process is introduced

FPC flexible printed circuit board is a major categories in printed circuit board. According to the structure of FPC flexible printed circuit board, according to the conductor layer can be divided into single panel, double panel, sandwich plate. Printed circuit board is the foundation of the electronics industry products, widely used in communications equipment, computer, automotive electronics and industrial equipment and various household appliances and other electronic products, its main function is to support the circuit components and interconnection circuit component.

As a kind of FPC PCB, multilayer PCB in today's electronic industry application is also more and more widely. Now, with the application of computer gradually popular, because of high functional demand, makes the wiring of large capacity, good transmission characteristics become FPC profes sional demands focus.

FPC profes sional production process:

Mention make a multilayer circuit board, it generally formed by the inner graphics to do first, and then to print etching made single side or double side board, and included in the specified between the layers, then through heating, pressure and adhesion. In fact, the basic method and that of the 1960 s can not much change, but with more mature materials and process technology, attached to the characteristics of sandwich plate also become more diversified.

Compared with other forms of PCB, multilayer PCB can increase wiring layer, thus increases the design flexibility; Because of high density, the connection between the components is reduced, thereby improving reliability. In addition, the device also can install circuit and magnetic circuit shielding layer, and the metal core cooling layer in order to satisfy special functions such as shielding, heat dissipation. Of course, multilayer circuit board is not entirely without faults. High cost, long cycle, need high reliability testing method, the above costs will need to greater effort.

To sum up, with the continuous development of electronic technology, especially the large scale and the extensive application of very large scale integrated circuit, FPC series of multilayer circuit board is fast development to the direction of high density, high precision, high count there is fine line, small aperture through hole, blind hole buried, high thickness ratio of aperture technology to meet the needs of the market.