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Soft PCB board the needs of the development of the modern electronic products

Release date:2021-12-09

Surging soft PCB board production and application of flexible PCB and promotion, said now more common in PCB with soft, rigid or flexible just say that it is the PCB layers. It adapted to the modern electronic products to the high density and high reliability, miniaturization, lightweight direction development, but also meet the requirement of strict economy and the needs of the market and technology competition.

A soft, PCB board classification and advantages and disadvantages

1. Soft single-sided PCB board

Soft single-sided PCB board, only a conductor layer, the surface can be covered or not covered layer. Used in the insulation material base, with varying according to the application of the product. General common insulating materials with polyester, polyimide, ptfe, soft epoxy glass cloth, etc.

Soft single-sided PCB board can be further divided into the following four categories:

1. No cover single connection

This kind of soft PCB line graph on the insulating substrate, wire surface layer. As is usually the single rigid PCB. This kind of product is one of the most cheap, usually used in the key and the applications of environmental protection. The interconnection is with tin welding, welding or bonding. It is used in the early days of the telephone.

2. Cover single connection

This class compared to before the class, just according to customer's requirements in the conductor surface with a layer of covering layer. The solder is required for a cover, simply can not cover in the region of the end. Required precision can be in the form of clearance holes. It is a single most, the most widely used in soft PCB, widely used in the automobile instrument, electronic instrument.

3. Double connection without covering layer

This type of connection plate interface in front and back of the wire connection. To do this, in the welding plate on the insulating substrate of open a via hole, the via hole in the insulation substrate on the required position of the first strike, etching or other mechanical methods. It for two yuan installation, devices and need to soldering, pathways in welded panel without insulating substrate, such welded panel is usually removed by chemical methods.